|
|
技术指标Specifications |
产品品种 Board Type |
双面板/多层板(3-16层) Double-Sided
P.C.B./Multilayer P.C.B,3-16 layers |
|
基板材料 Board
Material |
FR-4,CEM-3,高Tg |
最大板厚 Board thickness Max 4mm |
|
最小芯板厚度 Core thickness Min 0.1mm |
成品尺寸 Finished Board Size |
最大双面板尺寸 Max. Double Sided P.C.B. |
620 mm * 420mm |
最大多层板尺寸 Max. Multilayer P.C.B. |
569mm * 410 mm |
成品孔直径(金属化孔) Diameter (PTH) |
最小成品孔径 Min.PTH Dia |
0.1mm |
导线宽度和导线间距 Conductor Width &
Space |
最小导线宽度 Min. Conductor Width |
0.1mm |
最小导线间距 Min. Conductor Space |
0.1mm |
镀层和涂层厚度 Plating & Coating
Thickness |
孔壁镀铜层厚度 PTH Wall Copper Thickness |
>0.025 mm |
焊锡厚度(热风整平板、无铅热风整平板)
Solder Coating Thickness ( Hot Air Leveling and Lead-free Hot Air Leveling)
|
>1.0 um |
插头镀镍和镀金层厚度 Tab Nickel & Gold Plating Thickness |
(若客户有特殊需要,可按客户要求生产) or as specified by customer |
镀镍层 Nickel Plating Thickness |
>2 um |
镀金层 Gold Plating Thickness |
>0.3 um |
化金层 Gold Melting Thickness |
>=0.05um |
光板测试 Bare Board Test |
单面测试 Single Side |
最大测试点 Max. Testing Points |
20480(通用Universal) |
最大可测板尺寸 Max.
Testable Board Size |
400mm*300mm |
双面测试
Double Side &
Multi-layer |
最大测试点 Max. Testing Points
|
40960(通用Universal) |
| 10240(专用Special) |
最大可测板尺寸 Max. Testing Board Size |
406mm * 328mm |
| 320mm * 400mm |
表面封装的最小可测节距 Min. SMT Pitch |
0.3mm |
测试电压 Test Voltage |
10-250V |
特殊机加工 Special Machine Work |
插头处倒角 Tab Chamfer |
20 °,30°,45°,60° |
角度误差 Angle Tolerance |
±5° |
深度误差 Depth Tolerance |
±0.25 mm |
V型槽切割 V-Cut |
|
板的厚度 Board Thickness |
0.3mm-3.2 mm |
残留的厚度 Web Thickness |
±0.02 mm |
槽定位精度 Slot Position Tolerance |
±0.02 mm |
外型加工公差
Special Machine Word |
|
±0.1 mm |
板翘曲
Board Machine Work |
最大值 Max |
<0.8% |
光绘图 Photoplotting |
最大绘图面积 Max. Plotting Area |
660 mm * 558.8 mm |
精度 Tolerance |
±0.01 mm |
重复精度 Reproduce Tolerance |
±0.005 mm |
最小线宽 Min. Line Width |
0.05
mm |